Honor will be among the first smartphone manufacturer to make use of the soon to be released Snapdragon 888 Plus chipset from Qualcomm. This chipset will power smartphones to be launched in the second half of 2021 and beyond.

And Honor has come out to state that the company will be using this chipset to power the Honor Magic 3 series flagship devices.

See Also: MediaTek Dimensity 1200 vs Snapdragon 888: Chipset Comparison

According to Fang Fei, the president of product line, Honor Device Co., Ltd “…The game-changing advancements we see in the new Snapdragon 888 Plus 5G Mobile Platform make it a perfect fit for HONOR’s upcoming Magic3 series flagship.”

Honor is expected to announce two Magic phones this year (Magic Fold and Magic Flip). It has been reported that one will be a foldable device and it is expected to launch as the Honor Magic Fold.

See Also: Honor to launch Affordable 5G Phones using Dimensity 700 and 1200 Chipsets

The Snapdragon 888 Plus chipset earlier appeared on Geekbench with overclocked CPU and some improvements over the Snapdragon 888. And it was earlier thought that the chipset would be available only for Honor.

But, the recent press statement from Qualcomm confirms that other smartphone manufacturers will also be making use of the chipset.

See Also: HarmonyOS has an inbuilt feature that easily detects fake chargers

ASUS’s general manager of smartphone business, Bryan Chang, has confirmed that the Snapdragon 888 Plus will appear in a ROG phone.

Vivo and Xiaomi have also confirmed that they will announce phones powered by the new processor. Other phone manufacturers not mentioned above is also expected to make use of the new Qualcomm chipset in the flagship devices.

See Also: HMD Global to launch Nokia G20 in the U.S. with small price tag

For now, we don’t know which phone will first debut with new chipset. But, we’ll put our money on Honor devices. Whichever the case, we’ll keep you updated.


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