The CEO of Huawei Richard Yu confirmed on Weibo that the new Huawei Mate X2 will be unveiled by February 22. According to him, the new Huawei foldable flagship “will lead the new form of smartphones in the future”.

And as you can see from the leaked imgeas of the phone below, it has an inward-folding design which is very different from the original Mate series design.

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Also, it was also revealed today that the new Huawei Mate X2 will be powered by the Kirin 9000 SoC. Which is kind of surprising given that Huawei was said to have stopped chipset production since September last year.

But, we could all agree that Huawei will definitely use it’s best chipset to power it foldable flagship device.

The Mate X2 has previously passed through TENAA and it was said to have 6.45 external display with a 21.9 aspect ratio and a 1160 X 2700 px resolution (which is kinda better than the 25:9 display of the Galaxy Z Fold2).

Also, the internal screen is expected to be the largest display spotted on a foldable phone yet. It will be measuring about 8.01″ in diagonal (2220 X 2480 px resolution, with an aspect ratio of 10:9). When it is unfolded, the dimensions are said to be 161.8 X 145.8 X 8.2 mm.

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A 4400mAh battery with 66W fast charge is expected to power the new Huawei Mate X2 foldable phone. There is also going to be a quad rear camera of 50 + 16 + 12 + 8 MP.

Leakster Digital Chat Station posted images that showed the Mate X2 in closed and open positions. The images shows that there is dual punch hole on the external screen (with a 16 MP selfie camera) while the large internal screen is spotless, free of any holes and notches (full display).

Although information from TENAA are quite reliable, there has been no official statement from Huawei yet regarding the selfie and spotless inside display. All Huawei CEO revealed on Weibo are the inward-folding design and use of Kirin 9000 chipset.

Source 1 | Source 2 (Written in Chinese)