MediaTek has been dominating the mobile tech industry for various reasons. The latest reason of its domination is the release of the MediaTek Dimensity 9000 5G chip. This is the world’s first TSMC chipset built on the 4nm process.

But, today a leak has surfaced online listing the possible specs of a premium mid-range chip from the company. And this chip is called the MediaTek Dimensity 7000.

See Also: Apple A15 Bionic vs MediaTek Dimensity 9000: chipset comparison

According to DCS on Weibo, the Dimensity 7000 chip is built on same 5nm process as the Apple A15 Bionic and Qualcomm Snapdragon 888+.

The incoming chip features an 8-core CPU that consists of four Cortex-A78 performance cores with speed clocked at 2.75 GHz. There is another four Cortex-A55 efficiency cores with speed clocked at 2.0GHz.

See Also: MediaTek Dimensity 9000 vs Snapdragon 888+: Specs Comparison

Going by the specs above, this SoC will be very good in the premium mid-range smartphone sector. Just to clear things up, the CPU of the Dimensity 7000 is quite similar to that of the Dimensity 1200.

However, the key difference here is that the four performance cores are all clocked at the same frequency. Whereas with the Dimensity 1200, the performance cores was 1+3 (one Cortex-A78 at 3.0GHz, and three at 2.6GHz).

See Also: Qualcomm set to release a new chip for laptops and desktops

This chip is accompanied by the Mali-G510 MC6 GPU for graphics and gaming. And this GPU is bringing better performance and battery efficiency according to ARM.

Selling incredible but affordable chipset is key to MediaTek been the global chip maker in 2021. If this Dimensity 7000 is good in real life performance as it seems on paper, well Qualcomm will have to double its efforts to beat that in 2022.

See Also: Between Qualcomm and MediaTek Chipset, Which is better?

The first smartphones to use this chip is expected to be available by Q1 of 2022. Let’s hope this chip is as good as it seems.

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