MediaTek Dimensity 7050 Specs: The MediaTek rebranding phase has started with the Dimensity 7050- a repackaged version of the Dimensity 1080 chipset. Nothing new here. But let’s figure out more details below.
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MediaTek Dimensity 7050 Specs
The MediaTek Dimensity 7050 SoC is built on TSMC’s N6 6nm process. A 5G chipset that supports Dual 5G SIM of Sub-6 GHz. It features 2x Arm Cortex-A78 performance cores clocked at 2.6GHz and 6x Arm Cortex-A55 power-efficiency cores humming at 2.0GHz. The GPU side is covered by the Arm Mali-G68 MC4.
For its RAM and Storage technology, the chipset has support for LPDDR4X & LPDDR5 RAM and UFS 3.1 / UFS 2.2 storage. The new chipset supports up to 200MP camera sensors and 4K video recording at 30FPS.
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Dimensity 7050 chipset supports FHD+ at 120Hz refresh rate. As per connectivity, the chipset supports Wi-Fi 6, Bluetooth 5.2, NFC, and sub-6Ghz 5G connectivity.
Realme 11 Series and Lava Agni 2 5G are the first phones to use the MediaTek Dimensity 7050 5G chipset. In our subsequent posts, we shall compare the chipset to others in the industry. Tell us in the comments section which comparison you’d like to see.
| CPU | 2x Arm Cortex-A78 @2.6GHz 6x Arm Cortex-A55 @2GHz |
| GPU | Arm Mali-G68 MC4 |
| Display | FHD+ 120Hz |
| Camera | 200MP |
| Memory Storage | LPDDR4X/5 UFS 3.1 |
| 5G | Sub-6GHz |
