MediaTek Dimensity 9300 Specs: The Dimensity 9300 chip is MediaTeks’s latest mobile SoC that will power the vivo X100, OPPO Find X7, etc. The flagship chipset will compete with the likes of Snapdragon 8 Gen 3, Apple A17 Pro, Google Tensor G3, and Exynos 2400 chipsets. Below are the full MediaTek Dimensity 9300 Specs.
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MediaTek Dimensity 9300 Specs
The Dimensity 9300 is built on TSMC’s third-generation 4nm+ process node. It features an all-big core CPU design while still maintaining the 1+3+4 architectural design. According to MediaTek, the chipset offers a 40% upgrade in peak performance compared to last year’s Dimensity 9200 while using 33% less power.
MediaTek Dimensity 9300 features an octa-core processor. The prime Cortex-X4 core is clocked at 3.25GHz alongside, 3x Cortex-X4 cores @ 2.85GHz and 4x Cortex-A720 cores @ 2.0GHz all based on the Armv9 architecture.
In terms of graphics, the Dimensity 9300 chipset brings a new Immortalis-G720 MC13 GPU with 12 cores. This can offer 46% better hardware Ray Tracing than its predecessor while drawing 40% less power.
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Additionally, the chipset supports the latest LPDDR5T RAM @ 9,600Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
AI works are taken care of by APU 790. The APU supports Generative AI with Stable Defusion generation in less than 1 second and LLM with up to 33 billion parameters. While the Image capture is handled by the Imagiq 990 ISP with always-on HDR. The ISP can handle up to 8K video at 30 fps or 4K at 30/60 fps with cinematic mode and real-time bokeh.
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Lastly, there’s support for screens with up to WQHD resolution and 180Hz refresh rates as well as dual-active displays for foldable. As per connectivity, it offers Wi-Fi 7, Bluetooth 5.4, NFC, USB-C 3.2, sub-6Ghz, and mmWave 5G connectivity.
