MediaTek Dimensity 9300 Specs: The Dimensity 9300 chip is MediaTeks’s latest mobile SoC that will power the vivo X100, OPPO Find X7, etc. The flagship chipset will compete with the likes of Snapdragon 8 Gen 3, Apple A17 Pro, Google Tensor G3, and Exynos 2400 chipsets. Below are the full MediaTek Dimensity 9300 Specs.
MediaTek Dimensity 9300 Specs
The Dimensity 9300 is built on TSMC’s third-generation 4nm+ process node. It features an all-big core CPU design while still maintaining the 1+3+4 architectural design. According to MediaTek, the chipset offers a 40% upgrade in peak performance compared to last year’s Dimensity 9200 while using 33% less power.
MediaTek Dimensity 9300 features an octa-core processor. The prime Cortex-X4 core is clocked at 3.25GHz alongside, 3x Cortex-X4 cores @ 2.85GHz and 4x Cortex-A720 cores @ 2.0GHz all based on the Armv9 architecture.
In terms of graphics, the Dimensity 9300 chipset brings a new Immortalis-G720 MC13 GPU with 12 cores. This can offer 46% better hardware Ray Tracing than its predecessor while drawing 40% less power.
Additionally, the chipset supports the latest LPDDR5T RAM @ 9,600Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
AI works are taken care of by APU 790. The APU supports Generative AI with Stable Defusion generation in less than 1 second and LLM with up to 33 billion parameters. While the Image capture is handled by the Imagiq 990 ISP with always-on HDR. The ISP can handle up to 8K video at 30 fps or 4K at 30/60 fps with cinematic mode and real-time bokeh.
Lastly, there’s support for screens with up to WQHD resolution and 180Hz refresh rates as well as dual-active displays for foldable. As per connectivity, it offers Wi-Fi 7, Bluetooth 5.4, NFC, USB-C 3.2, sub-6Ghz, and mmWave 5G connectivity.