Qualcomm’s Next-Gen Flagship SoC: Thanks to a Geekbench listing that surfaced last week, we were able to see some specs of the Qualcomm Snapdragon 888+ chipset. But, it appears that is not going to be the biggest flagship chipset that will be released by Qualcomm this year.
According to a tweet by leaker Evan Blass, the successor of the Snapdragon 888 will be a true upgrade in every sense. Evan shared a preliminary spec sheet of the next-gen flagship SoC on his Twitter page.
The next Qualcomm flagship chipset known for now as SM8450 or Waipio will be fabricated on a 4nm process. It will also feature the latest Qualcomm X65 5G modem which offers wireless download speeds of up to 10 Gbps compared to the 7.5Gbps on the X60 5G modem in the Snapdragon 888.
Included in the package of the next-gen Qualcomm SoC is the brand new ARMv9 chip architecture with Kryo 780 cores. Although there is no much details about the GPU yet, but it’s said to be Adreno 730 – an upgrade of the Adreno 660. The camera interface will rely on the all-new Spectra 680 ISP which is also yet to be detailed.
Qualcomm’s FastConnect 6900 chip will handle Bluetooth 5.2 and Wi-Fi 6E connectivity. The leak also details new Adreno 665 video processing unit and an Adreno 1195 display processing unit.
Check out the rumored/leak components of Qualcomm’s next-gen flagship SoC below:
SM8450 or Waipio Key Components
- Kryo 780 CPU built on Arm Cortex v9 technology
- Adreno 730 GPU
- Spectra 680 ISP
- Up to 1GHz mmWave downlink and 400MHz Sub-6 D
- Support for Qualcomm Aqstic WCD9380/WCD9385 audio codec
- Qualcomm secure processing unit (SPU260)
- Support for Qualcomm FastConnect 6900 subsytem
- Support for quad-channel package-on-package LPDDR5 RAM
- Adreno 665 video processing unit (VPU)
- Adreno 1195 display processing unit (DPU)
The Qualcomm Snapdragon 888 SoC is good but this new chipset from Qualcomm is promising to be even better. Let’s wait and see what else the next-gen SoC from Qualcomm is bringing.