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MediaTek is bringing Dimensity 2000 to compete with Snapdragon 898

In the smartphone industry, there is this not so popular war between chipset manufacturers. And as Qualcomm is gearing up to bring the Snapdragon 898 flagship chip, MediaTek is bringing the Dimensity 2000 to compete.

There has been rumors about the next Qualcomm flagship chip but not so much about that of MediaTek until now. According to reports from leaksters @DCS and @Fertile, the MediaTek Dimensity 2000 will use TSMC’s 4nm process. The reports claims that MediaTek chip will have a stable power consumption and strong hardware specifications.

MediaTek has adopted the ARM V9 architecture and this is expected to boost the performance of the Dimensity 2000 flagship chipset. From the reports, tests are been carried out by smartphone companies using the Dimensity 2000 chip, And if all goes well, we might actually see a smartphone that is powered by this chip by the end of 2021 or early 2022.

MediaTek Chipset
MediaTek Chipset

And going by the calculation above, it means phones with Snapdragon 898 chip and Dimensity 2000 chip might launch almost same period. And from past experience, Qualcomm chipset has always been better but MediaTek chip has always been more affordable.

The CPU inside the Dimensity 2000 is said to be same as Qualcomm’s next-generation product, Snapdragon 898, or even stronger. As for GPU, it will be stronger than Snapdragon 888, and its power consumption will perform better. This new MediaTek processor is better than the current Dimensity 1200, saves more power and is better than the Snapdragon 888 series.

Dimensity 2000 Running Score

This chip will use the ARM V9 architecture with a Cortex X2 super-large core. The running score of this chip may exceed 900,000 points. However, projections for the Snapdragon 898 shows that it’s running score may exceed a million for the first time.

The Dimensity 2000 chip will use the ARM V9 architecture with a Cortex X2 super-large core. The running score of this chip is expected to exceed 900,000 points. However, it’s still lower than 1,000,000 points expected from the Snapdragon 898.

Qualcomm flagship chip
Qualcomm flagship chip

Dimensity 2000 Performance Improvements

Comparing the Cortex X2 inside the Dimensity 2000 with the Cortex X1 core used by Snapdragon 888, the X2 boost of at least 17% increase in performance. The power consumption is also reduce by some 10%. And there is also a significant performance improvement of the A710 core and the A510 core.

Since this year’s Snapdragon 888 and Snapdragon 888 Plus processors have massive power consumption, it is very difficult to suppress the heat of the product itself.

Both the incoming Snapdragon 898 and Dimensity 2000 make use of TSMC’s 4nm process. And this makes both chipset rivals. But as always, the Qualcomm Snapdragon chip is expected to be more expensive while the MediaTek Dimensity chip is expected to be cheaper.

Whatever the case, just know that MediaTek is bringing the Dimensity 2000 chip to compete with the Qualcomm Snapdragon 898. And such competition is very healthy in the smartphone industry.






One response to “MediaTek is bringing Dimensity 2000 to compete with Snapdragon 898”

  1. Danny Avatar

    If media tek’s upcoming demensity 2000 has no heating problems that alone would make it superior to Qualcomm upcoming snapdragon 898 which is rumored to have the same heating problems of their outgoing 888.

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